The AMAOE SAM-17 stencil is a high-precision BGA reballing stencil specially designed for Samsung Galaxy S22 Series motherboard repair and chip-level maintenance. It supports both Exynos 2200 and Snapdragon SM8450 platforms used in the Galaxy S22, S22+, and S22 Ultra models.
Main Features
- Precision 0.12mm stainless steel mesh
- High temperature and deformation resistance
- Accurate solder ball alignment
- Reusable professional stencil
- Suitable for leaded and lead-free soldering
- Ideal for CPU, RAM, PMIC, and RF IC reballing
Compatible Models
- Samsung Galaxy S22 — S901
- Samsung Galaxy S22+ — S906
- Samsung Galaxy S22 Ultra — S908
Supported CPUs / ICs
- Exynos 2200 / E9925
- Snapdragon 8 Gen 1 SM8450
- PM8450
- PM8350 / PM8350C
- PM8350BH
- WCN6851 / WCN6856
- SDR735
- MAX77705C
- QET7100
- BGA153
- 77098
- 77040 / 77048E
- 58080
- TN2145
- SPS25 / SPS26 and more
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