AMAOE QU-9 Qualcomm CPU Reballing Stencil AMAOE QU-9 Stencil The AMAOE QU-9 stencil is a professional BGA reballing stencil specially designed for Qualcomm Snapdragon flagship CPU repair and motherboard

The AMAOE QU-9 stencil is a professional BGA reballing stencil specially designed for Qualcomm Snapdragon flagship CPU repair and motherboard micro-soldering work. It provides precise solder ball alignment and accurate solder paste application for advanced chip-level repair operations.

Main Features

• High precision 0.12mm stencil thickness
• Super hard stainless steel material
• Precision laser-cut square apertures
• Heat resistant and reusable design
• Stable solder ball positioning
• Suitable for leaded and lead-free soldering processes

Supported Qualcomm CPUs / ICs

• SM8750
• SM8635
• SM8650
• SM8550
• SM8450
• SM8350
• SM7550
• SM7475
• BGA496 layouts

Applications

• Qualcomm CPU reballing
• BGA chip repair
• Android motherboard repair
• CPU and RAM soldering
• Professional GSM micro-soldering work
• Flagship Android device maintenance

Compatible Smartphone Brands

Compatible with flagship devices using Snapdragon Gen series processors from:

• Xiaomi
• Samsung
• OnePlus
• Vivo
• Oppo
• Realme
• iQOO
• Motorola
• Asus ROG
• Nubia
• Honor and more.