The AMAOE SAM-15 stencil is a professional BGA reballing stencil designed for Samsung flagship devices like the Galaxy S21 series and foldable phones (Flip3 / Fold3). It is widely used in CPU, RAM, PMIC, RF and power IC rework on Snapdragon and Exynos platforms.
🔧 Main Purpose
- CPU / IC reballing (Snapdragon 888 / Exynos 2100)
- Motherboard repair (S21 / Flip3 / Fold3 series)
- Solder paste application on BGA pads
- PMIC, RF, RAM chip rework
- Advanced GSM micro-soldering work
⚙️ Features
- 0.12mm high-precision stainless steel
- Laser-cut aperture design for accuracy
- Heat resistant & reusable
- Stable ball alignment for fine-pitch chips
- Professional-grade Samsung repair tool
📱 Supported Devices
- Samsung Galaxy S21 (G991 series)
- Samsung Galaxy S21+ (G996 series)
- Samsung Galaxy S21 Ultra (G998 series)
- Samsung Z Flip 3
- Samsung Z Fold 3
- W22 variants
🧠 Supported Chips / ICs
- Snapdragon 888 (SM8350)
- Exynos 2100
- PM8350 / PMIC series
- QPM5825
- WCN / SDR / RF ICs
- MAX77705C
- RAM / BGA153 layouts
🧩 Applications
- Samsung flagship motherboard repair
- No power / dead boot repair
- Network / signal repair
- BGA chip replacement
- GSM professional repair labs
⚠️ Important Note
The SAM-15 is mainly used for flagship CPU + IC reballing, not middle-layer sandwich repair like SAM-17 or S-series stencils.
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