AMAOE MI19 Reballing Stencil

The AMAOE MI19 stencil is a professional BGA reballing stencil designed for precise solder paste application and chip rework on Xiaomi flagship motherboards. It is mainly used for CPU, RAM, PMIC, and RF IC reballing during advanced motherboard repair and micro-soldering operations.

The stencil ensures accurate alignment of solder balls and solder paste on PCB pads and BGA chips, helping technicians perform stable and reliable chip-level repairs.

Main Functions

• Precise solder paste application on PCB solder pads
• BGA CPU and RAM reballing
• Chip rework and motherboard repair
• Accurate solder ball positioning
• Suitable for leaded and lead-free soldering processes

Features

• High precision aperture design
• Durable stainless steel construction
• Heat resistant and reusable
• Professional UBGA rework stencil
• Stable alignment for advanced soldering jobs

Supported Models / Chips

• 58080
• 57048E
• PM8580VE
• WCN7851
• PM8550BH
• SDR735
• VC7643
• SM8550
• BGA152
• RAM 496
• 27999
• 8550VS
• P1
• JE218
• QET7100