The AMAOE U-IP13 stencil is a universal CPU / IC reballing stencil designed for the latest Apple platforms like A19 and A19 Pro, used in iPhone 17 series motherboard repair. It is part of AMAOE’s “universal grid system” that supports multiple Apple CPU layouts in one stencil family.
According to manufacturer listings, it is used for CPU, NAND, RAM and small IC reballing, not only middle-layer repair.
🔧 Main Purpose
- CPU BGA reballing (A19 / A19 Pro chips)
- NAND / storage IC rework
- Small IC solder paste alignment
- iPhone 17 series motherboard repair
- Advanced Apple chip-level microsoldering
⚙️ Features
- 0.12mm ultra-thin stainless steel
- Universal A19 / A19 Pro layout support
- High precision laser-cut holes
- Heat resistant for hot air / IR stations
- Reusable and durable design
- Stable alignment for dense Apple chips
📱 Supported Devices / Platforms
- iPhone 17 / 17 Air / 17 Pro / 17 Pro Max
- Apple A19 / A19 Pro CPU platform
- New generation Apple motherboard layouts
🧠 Supported Work Areas
- CPU reballing pads
- NAND / storage IC pads
- RF / PMIC small chip zones
- Motherboard BGA chip alignment
🧩 Applications
- iPhone 17 motherboard repair
- No power / boot loop repair
- CPU replacement and reballing
- NAND repair and data recovery work
- Advanced GSM micro-soldering labs
⚠️ Important Note
Even though it is often called “universal”, the U-IP13 stencil is mainly for CPU-level reballing, not middle-layer sandwich board repair like IP17-012 or SAM series stencils.
🔥 Summary
The AMAOE U-IP13 stencil is a high-precision universal Apple CPU stencil for A19/A19 Pro chips, mainly used in iPhone 17 series CPU and IC reballing, not inter-layer motherboard repair.
Avis
Effacer tous les filtresIl n’y a pas encore d’avis.