he AMAOE SAM-8 stencil is a professional BGA reballing stencil designed for Samsung Galaxy Note 4 motherboard repair and Qualcomm APQ8084 CPU maintenance. It is used for precise solder paste application, solder ball positioning, and advanced chip-level repair operations.
This stencil helps technicians accurately rebuild solder connections on CPU, eMMC, RAM, and power IC components during motherboard repair and micro-soldering procedures.
Main Functions
- Precise solder paste application on PCB solder pads
- BGA CPU and eMMC reballing
- Chip rework and motherboard repair
- Accurate solder ball positioning
- Suitable for leaded and lead-free soldering processes
Features
- High precision aperture design
- Durable stainless steel construction
- Heat resistant and reusable
- Professional UBGA rework stencil
- Stable alignment for advanced soldering jobs
Supported Models
- Samsung Galaxy Note 4
- Note 4 N910 Series
Supported Chips / ICs
- APQ8084 CPU
- BGA529 eMMC
Applications
Ideal for:
- Samsung motherboard repair
- Qualcomm CPU reballing
- eMMC repair and rework
- BGA chip maintenance
- Mobile phone PCB repair labs
- Professional GSM technicians and micro-soldering workshops
Avis
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