AMAOE SAM-21 Stencil (Samsung Series Universal)

The AMAOE SAM-21 stencil is the latest universal Samsung BGA reballing stencil in the SAM series. It is designed for next-generation flagship processors, especially Samsung S25 / S25+ and Snapdragon 8 Extreme Edition platforms.

This stencil is used for CPU, RAM, PMIC, RF and advanced chipset rework in high-end mobile repair laboratories.

🔧 Main Purpose

• CPU / chipset BGA reballing
• Samsung flagship motherboard repair
• Solder paste application on ultra-fine pads
• Advanced IC replacement and rework
• Professional GSM micro-soldering work

⚙️ Features

• 0.12mm ultra-precision stainless steel
• Laser-cut square aperture design
• High thermal resistance for hot air / IR stations
• Reusable and durable construction
• Stable alignment for ultra-dense chip layouts

📱 Supported Platforms / Chips

• Snapdragon SM8750 (8 Extreme Edition)
• Samsung S25 / S25+ / S25 Ultra series (new generation boards)
• Universal flagship Samsung CPU layouts
• Next-gen BGA153 / advanced packaging ICs

🧠 Applications

• Samsung S25 series motherboard repair
• CPU reballing (flagship Snapdragon chips)
• No power / dead boot repair
• Signal / RF repair on new boards
• Advanced GSM lab micro-soldering

⚠️ Important Note

The SAM-21 is part of the new generation SAM universal series, mainly used for latest Samsung flagship CPUs, and is not compatible with older S series like S21–S23.

🔥 Summary

The AMAOE SAM-21 stencil is a high-end professional tool designed for latest Samsung flagship repair (S25 generation and SM8750 platforms), used in advanced motherboard repair environments.