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Amaoe Note 20 Ultra Stencil for Sam Note 20 Ultra N9860 Middle Layer Motherboard Reballing

Le prix initial était : 20.00 DT.Le prix actuel est : 15.00 DT.

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Estimated delivery: 16/07/2026 – 20/07/2026

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Description

The AMAOE Note 20 Ultra N9860 stencil is a middle layer motherboard reballing stencil designed for Samsung Galaxy Note 20 Ultra (SM-N9860) repair. It is mainly used for sandwich motherboard rework, helping technicians restore inter-board connections between the main PCB and sub-board during advanced chip-level repair.

It is widely used in GSM labs for Snapdragon Note 20 Ultra versions (N9860 / N986B variants depending on board layout).

Main Purpose

  • Middle layer (sandwich board) reballing
  • Solder paste application for interconnect pads
  • Restoration of motherboard communication lines
  • CPU / PMIC / RF inter-board repair support
  • Advanced board-level repair (no power / boot issues)

Features

  • High precision 0.12mm stainless steel
  • Laser-cut apertures for perfect pad alignment
  • Heat resistant and reusable
  • Designed for layered motherboard architecture
  • Stable stencil alignment for fine pitch pads

Compatible Device

  • Samsung Galaxy Note 20 Ultra
  • Model: SM-N9860 / N986 series variants
  • Snapdragon & regional board layouts depending on version

Supported IC / Areas

  • Middle layer interconnect pads
  • CPU communication lines
  • PMIC / RF inter-board signals
  • Sandwich motherboard solder joints
  • BGA interposer points

Applications

  • Note 20 Ultra motherboard repair
  • No power / dead boot repair
  • Signal & network issue repair
  • Sandwich board reballing
  • Advanced GSM micro-soldering labs

Caractéristiques

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