The AMAOE MI-18 stencil is a professional BGA reballing stencil designed for Xiaomi and POCO motherboard repair. It is mainly used for CPU, RAM, PMIC, and RF IC reballing operations on the POCO C40 platform and related BGA chip repairs.
Main Features
- High precision 0.12mm stainless steel mesh
- CNC square hole aperture design
- Heat resistant and deformation resistant
- Accurate solder ball positioning
- Reusable professional stencil
- Suitable for leaded and lead-free soldering processes
Supported Models / Chips
- Xiaomi POCO C40
- SOSG761 CPU
- VC7643
- VC7916-36
- PMJ510
- WCN3950
- SGM41542
- WCD9370
- WTR2965
- BGA153
- BGA200
Applications
- CPU reballing
- RAM and PMIC soldering repair
- Xiaomi motherboard maintenance
- POCO PCB repair
- Advanced GSM micro-soldering work
- BGA chip repair laboratories
Avis
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